Photonic Integrated Circuits (PICs) are a bleeding-edge technology that harnesses the power of light for the manipulation of information in a manner similar to traditional electronic integrated circuits. Unlike their electronic counterparts, which rely on electrons for signal processing, PICs utilize photons, or particles of light, to transmit and process data. This technology holds great promise for a wide range of applications due to its inherent advantages over traditional electronic circuits.
One of the key advantages of PICs is their ability to transmit data at extremely high speeds, as light travels much faster than electrical signals. This makes them ideal for applications in high-speed communication systems, optical networks, and data centers where rapid data transfer is crucial. Additionally, PICs offer enhanced energy efficiency, reduced heat generation, and improved reliability compared to electronic circuits, making them well-suited for applications demanding low power consumption and minimal heat dissipation.
PICs find applications in telecommunications, where they play a vital role in optical communication networks, enabling the transmission of vast amounts of data over long distances with minimal signal degradation. They are also utilized in sensing technologies, medical devices, and quantum computing, showcasing their versatility in different fields.
An overview of the development process (📷: J. Missinne et al.)
However, despite their immense potential, PICs are still a relatively new technology, and a number of challenges persist. One notable challenge is the interfacing of PIC chips with other components. This is most commonly achieved via fiber optic cables, and the positioning of these cables can interfere with the normal functioning of devices, particularly in the case of sensors where precise placement is critical. In search of a better solution to this problem, researchers at Ghent University have been experimenting with new interfacing techniques that are more flexible. This work has been centered around the use of microlenses that can be positioned in convenient locations on the PICs, so as to not block critical sensing elements.
In previous work, the team developed an interface solution involving etched microlenses that can be embedded out of the way, on the back side of the chip. However, the production process required complex and costly post-processing steps, rendering it impractical for most use cases. Other groups have leveraged microball lenses, which do not require complex post-processing steps, but they have another flaw of their own — the interface must be on the device side, where it can interfere with sensing components.
In the team’s latest work, they have built upon the previous microball lens work, adding only minimal processing work that involves polishing, and optionally the inclusion of an antireflective coating. These enhancements enable the interface to be placed on the back side of the PIC, where it will not interfere with sensing components. Moreover, the process is simple and practical for real-world manufacturing of PIC chips.
The Bragg grating temperature sensor interface (📷: J. Missinne et al.)
To test their innovation, the researchers modified a PIC Bragg grating temperature sensor. These sensors can accurately measure temperatures of over 350 degrees Fahrenheit, but due to their tiny waveguide dimensions — these are the internal connections in a PIC chip, analogous to copper traces in a conventional circuit — interfacing them with external components is very challenging. Further, conventional interfacing solutions can interfere with the sensing components due to their required placement locations.
With the help of their technique, involving the inclusion of a 300 micrometer ball lens on the back side of the chip, an optical connection was successfully, and unobtrusively, made to an external device. This standard readout equipment that the PIC was connected to was found to be capable of capturing measurements from the sensor.
Looking ahead, the researchers see potential applications for their technology in equipment used in medical devices, aircraft components, and beyond. They expect these new devices to lead to process optimization, energy savings, and cost savings.
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December 18, 2023 at 10:26PM
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